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The Society of Packaging Science & Technology, Japan organizes various events such as its annual meeting, symposiums, seminars and lectures. Your participation in such events is most welcome. Please refer to detail page for application.

28st Annual Meeting

Dates: July 11 and 12, 2019
Venue: Ichijo Hall, Yayoi Auditorium
Yayoi Campus, The University of Tokyo1-1-1
Yayoi, Bunkyo-ku, Tokyo

The Society of Packaging Science & Technology, Japan will hold its 28th annual meeting on July 11 and 12, 2019 at The University of Tokyo’s Yayoi Auditorium (Bukyo-ku, Tokyo).
Packaging protects food, daily necessities, electrical products, medicines and other products during transport and storage; it is essential for delivering products in the best possible condition to users and consumers. In addition to these fundamental functions, while packaging has various other functions including sales promotion and convenience, demands for diverse types of packaging, greater function and rationalization are increasing with changes in values and lifestyles. Issues that packaging must address continue to grow including addressing environmental issues such as climate change and universal design to meet the needs of an aging society as well as addressing regulatory concerns in various countries driven by globalization.
To address these diverse requirements for packaging, the oral and poster sessions at the 27th Annual Meeting had high quality presentations and active discussions . In addition, Professor Daisuke Ishii of the Nagoya Institute of Technology presented a fascinating invited lecture “Biomimetic control using surface structure for controlling liquids: water absorption, gas barrier”.
The 28th Annual Meeting in addition to oral presentation sessions covering topics including packaging materials, transport packaging, processing and machinery, environment and safety, and assessment techniques and poster presentations, the 13th International Packaging Seminar (IPS’19) will address regulatory issues impacting plastic packaging.
We are confident that the annual meeting will provide a meaningful venue for researchers and developers in various fields related fields to present their latest findings and mutually gain new insights through active discussions. Also, we are encouraging active participation including oral and poster presentations by students who are the future supporters of our society.
In order for the packaging industry to address the demands for diverse, high performance, rationalized packaging, it will need to bring to together a wide range of fields and technologies. The members of the annual meeting organizing committee are making every effort to provide a meeting for the participants that will contribute to future research and development, packaging science and the development of the packaging industry. We are looking forward to participation by researchers from a wide range of fields.

Naoki Konno
Annual Meeting Organizing Committee